The encapsulation vacuum defoaming and solidification assembly line has a wide range of applications in the semiconductor and integrated circuit fields, mainly including the following aspects:
The robot glue filling assembly line is a production line that combines automated robot technology with precision glue filling technology. Its core is used for glue sealing, insulation, or structural fixation of electronic components (such as sensors, LED modules, circuit boards), automotive parts, new energy components, and other products. Its characteristics revolve around four core advantages:
Desktop dispensing platform is a small precision dispensing equipment mainly used to correctly drip and apply glue or other fluids onto the surface or interior of products. It has the functions of improving production efficiency, ensuring dispensing accuracy, and reducing costs. It is widely used in industries such as electronics, automotive, and medical. as follows:
Vacuum sealing units are widely used in various industries such as electronics, automotive, aerospace, etc. The following is a specific introduction: