不要太粗了嗯嗯慢点视频,久久国产高清伦理久久一,精品国产你懂的在线观看

Focusing on fluid control equipment such as dispensing and dispensing

High accuracy/adaptability/flexibility

National Hotline:

0512-55198662

Your current location：Home page > Information dynamic > Industry Dynamics return

What are the applications of desktop dispensing platforms in the optoelectronic industry

source：www.tywdhb.com | Release time：2025年12月30日

The desktop dispensing platform has strong adaptability in the optoelectronic industry due to its high precision, small size, and flexible operation. Its core focus is on the dispensing needs of miniaturization, high precision, and high consistency, covering the entire production process of optoelectronic devices (packaging, assembly, die bonding, sealing, etc.). The following are segmented application scenarios+adaptation processes+core requirements, correctly integrating with industry practices:
Core applications of desktop dispensing platform in the optoelectronic industry (fully segmented scenarios)
1、 Core application logic
The desktop dispensing platform (including semi-automatic/fully automatic models) focuses on small stroke (usually 50-300mm), high precision (repeated positioning ± 0.01~0.05mm), and correct glue control (dispensing volume starting from 0.001ml). It is suitable for micro dispensing of small devices (chips, lenses, modules) in the optoelectronic industry, replacing manual labor to improve consistency and avoid overflow and shortage of glue affecting performance. It is an equipment for small and medium-sized production and R&D sampling in the optoelectronic industry.
2、 Segmented application scenarios (benchmarking upon implementation)
Scenario 1: Optical communication devices (core essential, high precision requirements)
Adapter components: fiber optic connectors, optical modules (SFP/QSFP), optical attenuators, couplers, wavelength division multiplexers
Key dispensing processes and applications
Fiber end face fixation/bonding: Epoxy/UV glue is applied at the contact surface between the connector core and the fiber to fix the fiber and ensure stable optical signal transmission. It is required to have no bubbles and a uniform adhesive layer (thickness ≤ 5 μ m)
Optical module packaging and sealing: sealant/thermal conductive adhesive is used to seal the gaps between the module housing and the base, preventing dust and water vapor from entering, while assisting in heat dissipation, and adapting to high-speed optical modules (10G/40G/100G)
Device pin reinforcement: Conductive silver glue is applied at the connection between the metal pins of the optical device and the substrate to reinforce and ensure conductivity, avoiding vibration and detachment
Core requirements of the platform: repeated positioning accuracy of ≤± 0.02mm, support for dispensing/drawing lines/surrounding glue, compatible with UV glue rapid curing linkage
Scenario 2: Display devices (batch adaptation, emphasizing consistency)
Adapter components: Mini/Micro LED, LCD/OLED module, touch screen, backlight module, camera module
Key dispensing processes and applications
Mini/Micro LED Solid Crystal Glue: Solid crystal glue/insulation glue is applied at the corresponding points on the PCB substrate to correctly bond the LED chip. The glue point diameter is ≤ 0.1mm to avoid uneven glue amount causing chip offset (affecting display consistency)
Touch screen bonding and edge sealing: The touch screen glass and touch layer edge points are sealed with waterproof sealant to prevent light leakage and water vapor, and the adhesive line is required to be continuous without breaks
Backlight module bonding: Apply hot melt adhesive/acrylic glue at the connection between the backlight board and the frame, as well as the light guide plate and the light strip, to fix them without affecting the light transmittance
Camera module fixation: lens holder and PCB board point structure adhesive ensure the accuracy of lens stabilization, and the adhesive layer has no shrinkage or deformation
Core requirements of the platform: support array dispensing (compatible with module batch production), correct and controllable dispensing volume, compatible with multiple types of hot melt adhesive/UV adhesive/structural adhesive
Scenario 3: Optical components (high-precision adaptation, pollution prevention)
Adapter components: optical lenses, filters, prisms, infrared lenses, laser lenses
Key dispensing processes and applications
Lens assembly and fixation: The low shrinkage epoxy adhesive between the optical lens and the lens holder is correctly positioned (coaxiality error ≤ 0.01mm), and the adhesive layer does not affect light transmission and imaging quality, with no bubbles or glue overflow
Filter adhesion: Infrared/ultraviolet filter and substrate point transparent UV adhesive, thin and uniform adhesive layer, does not block the filter area, no yellowing after curing
Prism group bonding: Optical special adhesive is used at the junction of multiple prisms to ensure correct refraction of the optical path, and the refractive index of the adhesive layer matches that of the prism
Lens edge protection: Wear resistant protective adhesive for lens edge points, scratch resistant, corrosion-resistant, and does not affect optical performance
Core requirements of the platform: high precision (repeated positioning ± 0.01mm), correct control of adhesive volume (dispensing volume 0.001ml), clean and dust-free tabletop, and support for seamless dispensing
Scenario 4: Laser devices (high temperature resistance+high reliability)
Adapter components: laser diode (LD), laser module, laser cavity, laser barcode scanner
Key dispensing processes and applications
Laser diode fixation: The LD chip and the heat dissipation base are fixed with high thermal conductivity silver glue, which not only fixes but also conducts heat (thermal conductivity ≥ 8W/(m · K)), avoiding chip overheating and burning out
Laser module packaging: The internal components of the module are insulated with thermal conductive adhesive, which is fixed while dissipating heat to ensure stable laser power
Laser cavity sealing: high-temperature resistant sealant (temperature resistance -40~200 ℃) for cavity gap points, preventing dust from entering and affecting laser purity, suitable for industrial lasers and medical laser devices
Core requirements of the platform: Support the dispensing of high viscosity adhesives such as thermal conductive adhesive, stable and non wire drawing adhesive, and adapt to high and low temperature adhesive curing environments
Scenario 5: Photovoltaic accessories (small batch+multiple specifications)
Adapter components: photovoltaic junction box, photovoltaic connector, photovoltaic module frame, micro inverter
Key dispensing processes and applications
Terminal fixing of junction box: The metal terminal points inside the junction box are reinforced with conductive adhesive to prevent outdoor vibration and detachment
Connector sealing: Waterproof sealant (IP67 rating) for photovoltaic connector interface points, suitable for outdoor sun and rain exposure, and anti leakage
Component frame bonding: photovoltaic glass and aluminum frame point structure sealant, strong weather resistance (UV resistance, high and low temperature resistance)
Core requirements of the platform: Compatible with high viscosity sealants, supporting enclosure/dot filling processes, and suitable for the dispensing needs of outdoor weather resistant adhesives
Scenario 6: Optoelectronic R&D sampling (flexible adaptation)
Adaptation scenarios: Optoelectronic new product sampling and small-scale trial production in university laboratories and enterprise R&D departments
Core application: Flexible dispensing that adapts to multiple samples, adhesive types, and processes, without the need for large-scale production line modifications, reducing research and development costs
Core requirements of the platform: simple operation, support programming storage (multi recipe memory), can quickly switch dispensing modes, compact size without taking up space
3、 Exclusive adaptation requirements for the optoelectronic industry (must see when selecting equipment)
Accuracy requirements: The core depends on the repeatability positioning accuracy. Optical communication/optical components should be ≤± 0.01~0.02mm, and display/laser devices should be ≤± 0.03~0.05mm
Adhesive type adaptation: It must be compatible with optoelectronic special adhesives (UV adhesive, epoxy adhesive, conductive silver adhesive, thermal conductive adhesive, optical adhesive), supporting low viscosity (≤ 100CPS) to high viscosity (≥ 100000 CPS) adhesive types
Pollution prevention: The countertop needs to be anti-static and dust-proof, with no wire drawing or dripping glue on the adhesive path to avoid contaminating the photoelectric sensitive components
Linkage function: Priority should be given to models with UV curing lamp linkage and temperature control table adaptation, to meet the needs of rapid curing of photoelectric adhesive and temperature control dispensing
Travel adaptation: Choose according to the size of the device. For small devices (chips, lenses), choose a travel of 50-150mm, and for module types, choose a travel of 150-300mm

prev: Without the next: What are the applications of automatic gluing lin…